Engineered Films

Acrylonitrile-butadiene-styrene (ABS) is a flame retardant V0 extrusion material for applications in blow molding and sheet extrusion for vacuum forming.

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Acrylonitrile-butadiene-styrene / Polycarbonate (ABS/PC) is a general purpose extrusion film with good toughness and strength, used for sheet and profile extrusions.

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Acrylonitrile-styrene-acrylate (ASA) is a medium impact low gloss resin with good resistance to weather aging. ASA has good melt strength for extrusion and thermoforming.

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ECTFE is a strong, hard, tough, abrasion resistant film that retains its useful properties over a broad range of temperatures. ECTFE films have outstanding low temperature properties and have demonstrated excellent weathering properties in relation to UV radiation and common industrial or environmental pollutants. ECTFE films also exhibit high bulk and surface resistivity, high dielectric strength, low dielectric constant, and moderate dissipation factor. The dissipation factor varies slightly with frequencies > 1kHz.

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Ethylene-tri-fluoro-ethylene (ETFE) is a high performance resin that can be processed at relatively high rates compared to fluorocarbon resins. ETFE is inert to most solvents and chemicals, hydrolytically stable and weather resistant. Recommended upper service temperature is 150°C (302°F). Useful properties are retained at cryogenic ranges. The level and stability of dielectric ranges are excellent and the flame rating is V-0 by the UL-94 method.

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Poly-butylene-terephthalate (PBT) is an unreinforced injection moulding resin, with excellent flow properties, good hydrolitical stability and chemical resistance.

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Polycarbonate / Poly-ethylene-terephthalate (PC/PET) is an unfilled PC+PET blend, offering an excellent impact performance over a wide temperature range and very good flow characteristics combined with high heat resistance.

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Poly-ether-ether-ketone (PEEK) is a high-performance amorphous or semi-crystalline thermoplastic film with unique properties. PEEK films have high temperature resistance, excellent chemical and fatigue resistance and very high thermal stability. PEEK films exhibit superior mechanical and electrical properties at elevated temperatures in critical environments. PEEK film carries a VTM-0 class flammability rating (27μ) and exhibits a very low smoke and toxic gas emission when exposed to flame.

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Poly-ether-imide (PEI) is suitable for applications at high temperature. This amorphous polymer shows a combination of outstanding thermal, mechanical, and electrical properties, together with very low flammability. (PEI) resists a wide range of chemicals, has good resistance to UV and gamma radiation, and its high glass transition temperature allows the use at high temperatures while keeping the high mechanical properties.

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Poly-ether-sulfone (PES) is an amorphous thermoplastic material that combines excellent thermal stability, high strength and toughness, excellent hydrolytic stability, transparency, and good resistance to environmental stress cracking. PES shows good chemical resistance along with a high heat deflection temperature of 399°F (204°C). The coefficient of linear expansion remains constant at temperatures of up to nearly 200°C, making films suitable for applications where high heat/low shrink specs are needed.

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Polyimide (PI) is a film for use as a dielectric substrate for flexible printed circuits and high density interconnections. PI is the preferred dielectric film for very fine patch circuitry due to its superior dimensional stability, lay-flat, high modulus, and a coefficient of thermal expansion matched to copper. Polyimide also has very low moisture absorption and is laser abatable.

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Poly-methyl-pentene (PMP) is a strong, tough film that is dimensionally stable over a broad range of temperatures. It has high wear resistance and outstanding flexural and tensile properties.

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Poly-phenylene-ether/ Poly-amide (PPE/PA) exhibits an excellent balance of non- halogenated flame retardance, dimensional stability, high heat resistance, strength, and flow.

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Poly-phenylene-ether (PPE/PS) displays good qualities of chemical resistance and low water absorption.

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Poly-phylene-sulfide (PPS) possesses qualities of good chemical resistance, Low water absorption, and good wear properties.

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Poly-phenyl-sulfone (PPSU) is an amorphous thermoplastic material that offers exceptional hydrolytic stability, and toughness superior to other commercially-available high-temperature engineering films. The polymer is inherently flame retardant, and also has excellent thermal stability, Making films suitable for applications where very low shrink at high temperatures are needed.

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Poly-sulfones (PSU) are tough, rigid, high-strength thermoplastics that are suitable for continuous use up to 300 °F (149 °C). The resins are resistant to oxidation and hydrolysis and withstand prolonged exposure to high temperatures and repeated sterilization. Polysulfones are highly resistant to mineral acids, alkali, and salt solutions. PSU is also highly resistance to degradation by gamma or electron beam radiation.

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Poly-vinylidene-flouride (PVDF) is chemically inert to most acids, aliphatic and aromatic organic compounds, chlorinated solvents, alcohols, etc. PVDF also has a very high purity, abrasion resistance, and a relatively low Coefficient of Friction. PVDF demonstrates excellent weathering properties and are also extremely resistant to UV radiation and common industrial or environmental pollutants.

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Tetra-fluoro-ethylene / hexa-fluoro-propylene /vinylidene fluoride (THV) is noted for clarity and displays excellent resistance to chemicals as well as UV.

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Thermoplastic polyester ether ( TPE) is both flexible and tear resistant in cold temperatures, TPE also displays a very low modulus grade and can be processed by many thermoplastic processing techniques like injection molding and extrusion.

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